Symposium on Reliability for Electronics and Photonics Packaging (IEEE-REPP) Dates: Nov. 12-13, 2020 Location: Silicon Valley, CA, USA Abstract due...
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Region News and Special Announcements
Illustrating the Impact of the Mathematical Sciences Sponsored by the NSF, from the National Academies of Sciences, Engineering, and Medicine, a series of...
Please join us for the 3rd Industry Spotlight session featuring: Bill Schmarzo, Chief Innovation Officer, Hitachi Vantara, giving a talk on “Determining the...
The Digital & Creative Innovations Team has created IEEE branded virtual backgrounds for video conferencing tools like Zoom, Skype, On24, and Microsoft...
New from IEEE Educational Activities Engineers and other technical professionals have to communicate effectively with their counterparts across the globe, and...
Build Your Career Webinar Series What Every – “Body” Is Saying Thursday, 18 June 2020 • 11:00 am – 12:00 pm ET by Elsa Velasco Paul;...
Submission Deadline extended: 30 September 2020 One of the purposes of a professional society is to recognize the accomplishments of their community. This...
Three IEEE technical Societies (Electronic Packaging, Electron Devices, Photonics) have released a new IEEE Roadmap for Heterogeneous Integration, intended to...
Register now for the IEEE Women in Engineering International Leadership Conference (WIE ILC) 2020 Virtual Series! NOW FREE We hope that the global IEEE...