Three IEEE technical Societies (Electronic Packaging, Electron Devices, Photonics) have released a new IEEE Roadmap for Heterogeneous Integration, intended to leverage advancing technologies to keep system-level improvements progressing according to Moore’s Law. We’re seeing these advances in high-performance computing, mobile, 5G, aero/defense, and elsewhere, and they’re all covered in this Roadmap (over 600 pages). This spring and summer, there will be ~20 1-hour free webinars covering each of the chapters, presented by the chairs of the 22 Working Groups — something that many IEEE members will find important to master for their careers. Three are “in the can”, and another 3 are set for later in June and during July. The Roadmap itself (90 MB) is freely available for download.
Free Access to new IEEE Heterogeneous Integration Roadmap (HIR) and Supporting Webinars
Find out (at no cost) the technologies that will phase in over the next 5, 10 and 15 years to integrate devices into subsystems and systems. The work of over 300 professionals around the world, in 22 Working Groups, this Roadmap covers high-performance computing, mobile, 5G, aero/defense, automotive and other use cases, including architecture, photonics, multi-chip, MEMS/sensors, modeling and simulation, security, test, devices and materials.
— View past Working Group Webinars or sign up for upcoming ones: https://eps.ieee.org/education/eps-webinars.html
— Download the full Roadmap or selected chapters: http://www.pwesling.com/hir
— Get on the EPS Dlist for HIR announcements: https://app.smartsheet.com/b/form/403434a83919404189e3ed3cc59ac11d
Paul Wesling, overall editor for the HIR
