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Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/289728

December 2021

Chiplet-In-Wafer Technology For The Development Of III-V RF ICs

New requirements for communication (e.g., 5G) and radar (e.g., automotive) applications at millimeter-wave frequencies have fostered the development of new packaging solutions for circuit and subsystem manufacturing. In the area of RF compound semiconductors, technologies for the co-integration of high-performance devices and silicon circuits have also emerged. HRL is developing a technology called MECAMIC (Metal Embedded Chiplet Assembly for Microwave Integrated Circuits) that uses GaN transistor chiplets integrated in the volume of passive interposer wafers. Engineering advances in chiplet manufacturing…

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