Glass-based Quantum Photonic Packaging at Fraunhofer IZM

Experience from chip-level integration, known from electronics and “classical” integrated photonics, may provide guidelines and solutions for quantum devices in communication and sensing. However, monolithic photonic platforms do not meet the stringent demands of most quantum applications. Integration of active opto-electronic components, such as light sources, photodiodes and modulators, can complete the spectrum of required building blocks. We have developed integration technologies and packaging solutions for quantum systems built on years of experience with glass-based electro-optic circuit boards (EOCBs) developed for data communication, with the structuring and stacking of thin glasses for micro-photonic assembling. Experience gathered with glass-based EOCBs is being extended at Fraunhofer IZM into the quantum domain by extending the single-mode optical guidance into the visible and NIR spectral range through innovative light-matter coupling interfaces, and by further development of hermetic glass joints for packaging of hybrid quantum systems. Speaker(s): Henning Schröder, Virtual: https://events.vtools.ieee.org/m/315449