Name: Advanced semiconductor packaging and the need for a workforce to support the growing semiconductor industry in the USA
Start: 2024-11-22T15:30:00+00:00
End: 2024-11-22T17:00:00+00:00
Location: Room: 311, PCC Willow Creek Center, 241 SW Edgeway Drive , Beaverton, Oregon, United States, 97006

Home » Events » Advanced semiconductor packaging and the need for a workforce to support the growing semiconductor industry in the USA

Follow Us

Latest News

Find Announcements

Past Announcements

Local Events

IEEE PES/PELS Lecture: Comparative Assessment of Control Realizations of Grid Forming Converters based on their Voltage Source Behavior

Engineering Your Financial Success

Arc Flash Hazards in Utility-Scale PV and BESS Systems

Spectrum Sharing for Joint Sensing and Communications

2024 November Boise IEEE Opcomm Virtual Meeting

Region Meetings

SusTech Talk Dec 2024 – Harnessing Sunlight for Energy Grids: Future Foresight Considerations for Sustainability

MOVE Tech Talk – DEC 2024 – Review of 2024 MOVE Disaster Deployments

IEEE Resources

Meta