Symposium on Reliability for Electronics and Photonics Packaging (IEEE-REPP)
Dates: Nov. 12-13, 2020
Location: Silicon Valley, CA, USA
Abstract due date: September 15, 2020.
Proposals for presentations in the fields of Reliability for Electronic and Photonic Packaging are solicited under the technical areas highlighted on the REPP website: https://attend.ieee.org/repp.
The symposium will focus on quantified reliability, accelerated testing and probabilistic assessments in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging.
The Symposium is driven by the Photonics and Reliability technical committees of EPS, and sponsored by EPS and the its Santa Clara Valley Chapter. Due to the evolving nature of the pandemic, the delivery platform for the Symposium will be decided by the end of September 2020.
Please download the Call for Presentations. Your abstract is due by 15 September 2020.
For questions, contact Richard Rao, REPP Program Chair, at firstname.lastname@example.org