Silicon Valley Area Chapter

(SCV, SF, OEB)

We invite all interested technologists to attend our upcoming Meetings, Webinars, Conferences, and Workshops listed below:

Packaging and Interconnect Technologies for Cryogenic and Quantum Systems (Michael Hamilton) — thin-film, multi-conductor, flexible, superconducting cables, low insertion loss …
Scheduled ical Google outlook
(on the Internet)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Packages (Ephraim Suhir) — vulnerable structural element, practical questions, predictions, failure probability, accelerated test choices …
Scheduled ical Google outlook
(on the Internet)
Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications (Zia Karim) — faster cure, lower temperatures, vacuum, thermal stability, properties …
Scheduled ical Google outlook
(on the Internet)
3D Packaging for Superconducting Qubits (RN Das) — more chips, microbump-based assembly, three-tier stacks, alignment accuracy, co-planarity …
Scheduled ical Google outlook
(on the Internet)
Bonding Technology for the Next Generation Integration Schemes (Jurgen Burggraf) — die shrink, yield, heterogeneous chips, interconnect challenges, wafer bonding …
Scheduled ical Google outlook
(on the Internet)
Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones (Jeroen Duis) — photonics motherboard, dissimilar components, hybrid integration, thermal management …
Scheduled ical Google outlook
(on the Internet)
Use of Flash Lamps to Achieve Non-equilibrium Soldering and Assembly using Conventional Solder Alloys (Rudy Ghosh) — anisotropic adhesives, alloys, fluxes, wearables, fabrics, results …
Scheduled ical Google outlook
(on the Internet)
Electromigration Failure of Solder Interconnects under Non-DC Conditions (CU Kim) — reliability concern, few studies, scaling issue, insights, testing runs, estimates …
Scheduled ical Google outlook
(on the Internet)
Qualification of Robo-Taxi: Environments and Failure Modes for Autonomous Vehicles (HL Shi) — self-driving profiles, stresses, approaches, analysis, failure examples, low-sample testing …
Scheduled ical Google outlook
(on the Internet)
Package Technology, Design, and Methodology Challenges and Solutions for High Bandwidth Electronic Systems (Kemal Aygun) — interchip, IO bandwidth, fan-out, 2.5D packaging, design, analysis, validation …
Scheduled ical Google outlook
(on the Internet)
Chiplet-in-Wafer Technology for the Development of III-V RF ICs (F. Herrault) — 5G, radar, compound semiconductors, co-integration, packaging solutions, in passive wafer interconnects …
Scheduled ical Google outlook
(on the Internet)
Sustainable Electronics – From Dumped e-Waste to a Circular Economy: What is Needed? (Mervi Kröckel) — legislation, EU targets, recycling steps, applied ecodesign, carbon neutrality, case studies …
Scheduled ical Google outlook
(on the Internet)
Integration of an Optoelectronic, Flexible Neural Stimulator for Implantable Retinal Prosthesis (Yu-Hsin Liu) — replace photoreceptors, neural stimulating array, flex substrate, silicon dielets, testing results …
Scheduled ical Google outlook
(on the Internet)
Quantum Fiber-Optic Interconnect Technology for Quantum Networks (B. Lee) — decoherence, cabled infrastructure, quantum-grade, ultra-low loss, system-on-chip …
Scheduled ical Google outlook
(on the Internet)
Growth in Semiconductor Packaging and Assembly: Are We in Another “Roaring 20s”? (Vardaman) — continued expansion, drivers, shortages, application areas …
Scheduled ical Google outlook
(on the Internet)

For earlier programs, please visit our Past Events page.

Read our Instructions for Speakers

This Intel package reveals ground-breaking technologies described in downloadable slides from previous meetings
Company visit to NViDIA, showing some of our officers