Silicon Valley Area Chapter

(SCV, SF, OEB)

We invite all interested technologists to attend our upcoming Meetings, Webinars, Conferences, and Workshops listed below:

Hardware Reliability Qualification of Robo-Taxi: Environmental Stress and Failure Modes for Autonomous Vehicle Modules/Components (Fen Chen) — self-driving profiles, stresses, approaches, analysis, low-sample testing, failure examples …
Scheduled ical Google outlook
(on the Internet)
Package Technology, Design, and Methodology Challenges and Solutions for High Bandwidth Electronic Systems (Kemal Aygun) — interchip, IO bandwidth, fan-out, 2.5D packaging, design, analysis, validation …
Scheduled ical Google outlook
(on the Internet)
Chiplet-in-Wafer Technology for the Development of III-V RF ICs (F. Herrault) — 5G, radar, compound semiconductors, co-integration, packaging solutions, in passive wafer interconnects …
Scheduled ical Google outlook
(on the Internet)
Sustainable Electronics – From Dumped e-Waste to a Circular Economy: What is Needed? (Mervi Kröckel) — legislation, EU targets, recycling steps, applied ecodesign, carbon neutrality, case studies …
Scheduled ical Google outlook
(on the Internet)
Ultrafast Time Domain Cryogenic CMOS Device Characterization Platform for Quantum Computing Applications (Pragya Shrestha) — cryo-CMOS, electronic functionality, device technology, low-temp models, low-power, measurements …
Scheduled ical Google outlook
(on the Internet)
Integration of an Optoelectronic, Flexible Neural Stimulator for Implantable Retinal Prosthesis (Yu-Hsin Liu) — replace photoreceptors, neural stimulating array, flex substrate, silicon dielets, testing results …
Scheduled ical Google outlook
(on the Internet)
Adding Stretchability to Flexible Hybrid Electronics by using Metal Gel Interconnects (Taylor Neumann) — wearables, health monitoring, pliable, comfortable, performance, curvature, motion …
Scheduled ical Google outlook
(on the Internet)
Advanced Packaging for Silicon Photonics Based Modules and Applications (Bernabé) — packaging techniques, mass manufacturing, reliability, complexity, scalability, cost …
Scheduled ical Google outlook
(on the Internet)
Quantum Fiber-Optic Interconnect Technology for Quantum Networks (B. Lee) — decoherence, cabled infrastructure, quantum-grade, ultra-low loss, system-on-chip …
Scheduled ical Google outlook
(on the Internet)
New Routes and Paradigms in Device Engineering for Nanoelectronics and Nanosystems — increased complexity, power reduction, variability, 3D integration, energy efficiency, application areas …
Scheduled ical Google outlook
(on the Internet)
Growth in Semiconductor Packaging and Assembly: Are We in Another “Roaring 20s”? (Vardaman) — continued expansion, drivers, shortages, application areas …
Scheduled ical Google outlook
(on the Internet)

For earlier programs, please visit our Past Events page.

Read our Instructions for Speakers

This Intel package reveals ground-breaking technologies described in downloadable slides from previous meetings
Company visit to NViDIA, showing some of our officers