Silicon Valley Area Chapter


Trends and Transitions in Semiconductor Packaging 🗓 🗺

-- business models, supply chain, technology requirements, forecast for 2018 and 2019 ...

Speaker: Dan Tracy, Senior Director Industry Research & Statistics, SEMI
Presentation Slides: “Trends and Transitions in Semiconductor Packaging” (1 MB PDF)
Meeting Date: Wednesday, February 14, 2018
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members. students, unemployed, $10 non-members

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Summary: While on the heels of a strong growth year, there are a number of transitions and inflection points influencing the future of semiconductor packaging. Such trends include changes in business models, a changing supply chain, and packaging technology requirements that are affecting the materials market. This presentation will highlight these changes and transitions, and it will also include the SEMI forecast for packaging material for both 2018 and 2019.

Bio: Dr. Dan Tracy, Sr. Director of Industry Research and Statistics at SEMI, is responsible for developing and executing the global strategy for SEMI industry research and statistics products and services. Current market statistics products include monthly and quarterly data programs covering semiconductor capital equipment, materials and components, with in-depth annual reports on a variety of topics such as packaging materials and trends in the China market. Tracy is responsible for preparing market reports and presenting on trends impacting the electronic materials and equipment markets globally. In addition, Tracy is responsible for managing market statistics partnerships globally.
Prior to joining SEMI in 2000, Tracy was a Research Associate with Rose Associates, a prominent market research and consulting firm specializing in electronics materials. Prior to this, Tracy was employed at National Semiconductor’s Package Technology Group.
Tracy has a Ph.D. in materials engineering from Rensselaer Polytechnic Institute, a M.S in materials science & engineering from Rochester Institute of Technology and a B.S. in chemistry from State University of New York (SUNY) College of Environmental Science and Forestry.

Scheduled meetings slides
TI Conference Center, Santa Clara Map