Silicon Valley Area Chapter

(SCV, SF, OEB)

Fourth Annual Symposium on Heterogeneous Integration 🗓

-- future packaging for mobile, HPC, automotive, 5G, health, Chiplets, work on 2021 Roadmap ...

Register Date: Wednesday, 24 February 2021
Time: 7:30 AM – 12:30 PM PST
(followed by two days of optional working-group meetings)
Cost: none
Location: On the Internet (via Zoom)
IEEE Heterogeneous Integration Roadmap logo Reservations: eps2102sym.eventbrite.com

The IEEE’s Heterogeneous Integration Roadmap is 600+ pages of details across all areas of advanced packaging, covering pre-competitive information for industry, working engineers, and academia. It is intended to guide product development over the next decade, with projections out through 2034.

Program Outline: (expect updates over the next several weeks, to add topics and speakers)
(all times USA-Pacific time – PST)
07:30 AM – Welcome & Thanks to organizers & Sponsors
07:40 AM – “HIR 2020 Retrospective”, William Chen, Fellow and Senior Advisor, ASE
08:10 AM – “The Future of Microelectronics After the Pandemic” Ajit Manocha, President and CEO, SEMI — industry update, supply chain interdependency, geopolitics, government support, HIR developments …
8:45 AM – “21st-Century Nano System for Abundant Data Computing”, Prof. Subhasish Mitra, ECE Department, Stanford University
09:25 AM – break
09:40 AM – Plenary 3: “Reimagining Co-design of HPC Systems for a Heterogeneous Future”, John Shalf, NERSC CTO, Lawrence Berkeley National Laboratory — architectural specialization, software, algorithms, accelerators, disruptive changes …
10:20 AM – “Accelerating Electronics and Photonics Innovation for Revolutionary Microsystems”, Gordon A. Keeler, Program Manager, Defense Advanced Research Projects Agency (DARPA) — disruptive advances, next-gen computing, communications, sensing, key programs, investments …
11:00 AM – break
11:10 AM – “Thermal Sciences for the Heterogeneous Future”, Prof. Kenneth Goodson, ME and MatSci Departments, Stanford University
11:50 AM – “Wrap-up and Charge to Heterogeneous Integration Roadmap Teams”, Nicky Lu, CEO and Chairman, Etron Technology
12:20 PM – Thanks to Symposium speakers; Days 2 & 3 TWG Workshop agenda review

February 25 & 26: TWG Working Group Meetings: Cross TWG Panels and discussions, plus Invited Speakers. No separate registration required — you will get the link for both the Symposium and the Working Group meetings.

All if the HIR presentations above, as well as the Working Group sessions, will be recorded/edited for replay on-demand, available for viewing by Tuesday, March 2nd. Please view those you missed, or which will assist you in your career. If you would like to participate in a discussion of these talks/sessions, a live one-hour dialog and Q&A session will be scheduled specifically for ease of access by Asia participants on March 8th & 10th, and all registrants will receive a brief EventBrite notice, with the Zoom link.

Scheduled conferences meetings webinars
(on the Internet) Map