Year: 2019
Heterogeneous Integration Roadmap: 3rd Annual Meeting 🗓 🗺
— future of mobile, HPC, automotive, 5G, health, Chiplets, work on 2020 Roadmap …
Recent Advances and Outlook for Heterogeneous Integration 🗓 🗺
— integrating dissimilar chips, 2.5 and 3D, various substrates, new processes, time-to-market, cost …
IoT and PoE: An Overview, Applications and Future Directions 🗓 🗺
— sensors, hardware, data centers, App connections, new services, increased power, heat density …
System in Package (SiP) for Miniaturized Electronics Modules: An Update 🗓 🗺
— miniaturized modules, technology landscape, requirements, solutions, flexible electronics …
Trends and Opportunities in Silicon Photonics Packaging for Networking Applications 🗓 🗺
— SiPh packaging, large-scale data centers, interconnects, long-haul networking, Roadmap, integration …
Advanced Packaging Trends & Electronic Materials in Era of Digital Transformation 🗓 🗺
— integration technologies, new applications, trends in 5G, Artificial Intelligence, IoT, autonomous driving …
IEEE Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 🗓
— scientific and engineering exploration of thermal, thermomechanical and emerging technology issues …
IEEE 69th Electronic Components and Technology Conference (ECTC) 🗓
— the best in packaging, components and microelectronic systems science, technology and education …
3D X-ray Characterization; High Density Hybrid Bonding for 2.5D/3D Applications 🗓 🗺
— chip-stacking, microbumps, issues, new process, low cost, sensors, MEMS, computing …
Designing Plastic Parts for Multi-Jet Fusion vs Injection Molding + Tour 🗓 🗺
— tour, comparison, considerations, cost, schedule, quality, case study, HP Z3D camera …
