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  1. Home

Year: 2019

Heterogeneous Integration Roadmap: 3rd Annual Meeting 🗓 🗺

Posted on December 20, 2019 by pwesling

— future of mobile, HPC, automotive, 5G, health, Chiplets, work on 2020 Roadmap …

Posted in conferences, meetings

Recent Advances and Outlook for Heterogeneous Integration 🗓 🗺

Posted on November 7, 2019 by pwesling

— integrating dissimilar chips, 2.5 and 3D, various substrates, new processes, time-to-market, cost …

Posted in meetings

IoT and PoE: An Overview, Applications and Future Directions 🗓 🗺

Posted on September 9, 2019 by pwesling

— sensors, hardware, data centers, App connections, new services, increased power, heat density …

Posted in meetings

System in Package (SiP) for Miniaturized Electronics Modules: An Update 🗓 🗺

Posted on September 9, 2019 by pwesling

— miniaturized modules, technology landscape, requirements, solutions, flexible electronics …

Posted in meetings, slides

Trends and Opportunities in Silicon Photonics Packaging for Networking Applications 🗓 🗺

Posted on August 30, 2019 by pwesling

— SiPh packaging, large-scale data centers, interconnects, long-haul networking, Roadmap, integration …

Posted in meetings

Advanced Packaging Trends & Electronic Materials in Era of Digital Transformation 🗓 🗺

Posted on May 28, 2019 by pwesling

— integration technologies, new applications, trends in 5G, Artificial Intelligence, IoT, autonomous driving …

Posted in meetings

IEEE Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 🗓

Posted on March 27, 2019 by pwesling

— scientific and engineering exploration of thermal, thermomechanical and emerging technology issues …

Posted in conferences

IEEE 69th Electronic Components and Technology Conference (ECTC) 🗓

Posted on March 27, 2019 by pwesling

— the best in packaging, components and microelectronic systems science, technology and education …

Posted in conferences

3D X-ray Characterization; High Density Hybrid Bonding for 2.5D/3D Applications 🗓 🗺

Posted on February 13, 2019 by pwesling

— chip-stacking, microbumps, issues, new process, low cost, sensors, MEMS, computing …

Posted in meetings

Designing Plastic Parts for Multi-Jet Fusion vs Injection Molding + Tour 🗓 🗺

Posted on February 1, 2019 by pwesling

— tour, comparison, considerations, cost, schedule, quality, case study, HP Z3D camera …

Posted in meetings
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Home  |  Contact IEEE Santa Clara Vally Chapter, EPS  |  Accessibility  |  Privacy & Opting Out of Cookies  |  Nondiscrimination Policy

IEEE Santa Clara Valley Chapter, EPS
Serving Silicon Valley and the SF Bay Area
© Copyright 2020 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions.
A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.