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Flexing, Bending and Stretching Toward Advances in Electronics for Medical and Industrial Applications
June 23 @ 12:00 pm - 1:00 pm
Flexible hybrid electronics (FHE) combine printed electronics on flexible or stretchable substrates with the performance of silicon-based semiconductors to enable applications that include wearable medical devices and industry sensors. This talk will review the challenges associated with interfacing hard and soft electronic components, design, materials selection, printing, processing, and testing of FHE systems. Applications to medical and industrial sensors will be incorporated throughout this presentation; their “concepts of operation” will guide the evaluation of performance and reliability. Outcomes from this work are expected to inform the eventual scale-up to roll-to-roll manufacturing. The IEEE Electronic Packaging Society’s (https://eps.ieee.org/hir) (HIR), a pre-competitive collaboration for global industry, academic and government scientists and engineers that are mapping the future of electronics systems, will be introduced. Much of the work presented in this talk was funded by NextFlex (DoD, Manufacturing USA) and is in collaboration with industry and university partners. Speaker(s): Mark Poliks, Virtual: https://events.vtools.ieee.org/m/315446