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Chiplet-In-Wafer Technology For The Development Of III-V RF ICs
December 9, 2021 @ 12:00 pm - 1:00 pm
New requirements for communication (e.g., 5G) and radar (e.g., automotive) applications at millimeter-wave frequencies have fostered the development of new packaging solutions for circuit and subsystem manufacturing. In the area of RF compound semiconductors, technologies for the co-integration of high-performance devices and silicon circuits have also emerged. HRL is developing a technology called MECAMIC (Metal Embedded Chiplet Assembly for Microwave Integrated Circuits) that uses GaN transistor chiplets integrated in the volume of passive interposer wafers. Engineering advances in chiplet manufacturing and assembly will be presented, along with a Process Design Kit and circuit demonstrators up to W-band. Speaker(s): Florian Herrault, Santa Clara, California, United States, Virtual: https://events.vtools.ieee.org/m/289728