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Advanced Packaging For Silicon Photonics Based Modules And Applications

October 21, 2021 @ 8:00 am - 9:00 am

Silicon Photonics (SiPh) is spreading widely as a technology for the mass manufacturing of Photonic Integrated Circuits (PICs). SiPh has increasingly become integrated into new generations of photonics modules for data centers, sensors, LiDARs, and emerging applications such as HPC, AI, and quantum computing. Each of these applications comes with specific requirements in term of packaging and reliability. This leads to the adoption of advanced packaging techniques to cope with these requirements. In this talk, we will review and analyze the current trends and how advanced packaging strategies are expected to ease electronic/photonic convergence, to manage the expectations in terms of complexity, scalability, and cost. Speaker(s): Stéphane Bernabé, Virtual: https://events.vtools.ieee.org/m/278499

Details

Date:
October 21, 2021
Time:
8:00 am - 9:00 am
Event Category:
Website:
https://events.vtools.ieee.org/m/278499

Venue

Virtual: https://events.vtools.ieee.org/m/278499
Virtual: https://events.vtools.ieee.org/m/278499 + Google Map

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