RESULTS OF LOW-TEMPERATURE POLYIMIDE PROCESSING FOR INTERCONNECT RDL IN NEXT-GENERATION 3D ADVANCED IC BACKEND APPLICATIONS 🗓

Sponsor: SCV/OEB/SF Jt. Section Chapter,EP21
Speaker: Kia Karim of Yield Engineering Systems
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Meeting Date: May 6, 2021
Time: 12 Noon
Cost:
Reservations: IEEE

Summary:
This talk will summarize research done on the physical, mechanical, thermal, and electrical properties of various types of Polyimide and Poly-Benz-Oxazole (PBO) materials after curing under different process parameters, under atmospheric and vacuum process conditions. At both conventional and low temperatures, the vacuum process resulted in higher thermal stability, lower outgassing, and better thermal properties. The vacuum cure also showed better dielectric strength as well as lower dissipation factor. The assumption that curing under vacuum reduces the amount of volatile and volatilizable material remaining in the film appears to be consistent with these results.

Bio: Kia Karim an IEEE Sr. Member, is currently Sr. Vice President and Chief Technology Officer (CTO) at YES (Yield Engineering Systems, Inc.), a leading supplier of semiconductor equipment for backend Advanced Packaging processes. Dr. Karim was previously Vice President of Business Development and Technology at AIXTRON/Genus (acquisitions) where he worked for over 15 years. Dr. Karim also held senior management positions at Applied Materials and Novellus, after starting his career at Sharp Microelectronics in 1994.
Dr. Karim received his PhD in Electronic Engineering from Dublin City University in Ireland, and his B.Sc. and M.Sc. degrees in Electrical and Electronic Engineering from Bangladesh University of Engineering and Technology. He recently completed the Certificate of Business Excellence in Executive Education from UC Berkeley’s Haas School of Business.
A pioneer in positioning W/WSi CVD, Low K PECVD, High K ALD, and III-V MOCVD processes for semiconductor logic and memory devices, Dr. Karim organized and moderated “III-V on Si” seminars jointly with Sematech at every pre-IEDM between 2006 and 2012. In addition to organizing or co-organizing several conference symposia and related transactions — including IWLPC, ECS and AVS — Dr. Karim has authored more than 40 published papers in peer-reviewed journals and holds 17 patents.

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